Method of operating an electrical energy storage device using microchannels during charge and discharge

ABSTRACT

A method is generally described which includes operating an electrical energy storage device or an electrochemical energy generation device includes placing an electrical load to draw current from the electrical energy storage device or the electrochemical energy generation device. The electrical energy storage device or the electrochemical energy generation device includes a housing having an external surface and an internal surface. The method also includes generating electricity by at least one component within the housing. At least one component is configured to generate electrical energy in combination with other components, chemicals, or materials residing within the housing. Further, the method includes thermal control the electrical energy storage device by transferring heat to a plurality of microchannels coupled to at least one of the internal surface of the housing or at least one components. Further still, the method includes rejecting the collected heat through a thermal sink coupled to the microchannels. The thermal sink is configured to transfer heat energy from the microchannels and to receive a fluid flowing through the microchannels.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is related to and claims the benefit of theearliest available effective filing date(s) from the following listedapplication(s) (the “Related Applications”) (e.g., claims earliestavailable priority dates for other than provisional patent applicationsor claims benefits under 35 USC §119(e) for provisional patentapplications, for any and all parent, grandparent, great-grandparent,etc. applications of the Related Application(s)).

RELATED APPLICATIONS

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,034 filed May 26, 2009, entitled SYSTEM ANDMETHOD OF ALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE ORAN ELECTROCHEMICAL ENERGY GENERATION DEVICE USING MICROCHANNELS, namingAlistair K. Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L. Wood,Jr. as inventors, filed contemporaneously herewith, which is currentlyco-pending, or is an application of which a currently co-pendingapplication is entitled to the benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,031 filed May 26, 2009, entitled SYSTEM ANDMETHOD OF ALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE ORAN ELECTROCHEMICAL ENERGY GENERATION DEVICE USING HIGH THERMALCONDUCTIVITY MATERIALS, naming Alistair K. Chan, Roderick A. Hyde,Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filedcontemporaneously herewith, which is currently co-pending, or is anapplication of which a currently co-pending application is entitled tothe benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,036 filed May 26, 2009, entitled METHOD OFOPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICALENERGY GENERATION DEVICE USING HIGH THERMAL CONDUCTIVITY MATERIALSDURING CHARGE AND DISCHARGE, naming Alistair K. Chan, Roderick A. Hyde,Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filedcontemporaneously herewith, which is currently co-pending, or is anapplication of which a currently co-pending application is entitled tothe benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,015 filed May 26, 2009, entitled SYSTEM FORALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR ANELECTROCHEMICAL ENERGY GENERATION DEVICE USING MICROCHANNELS BASED ONSTATES OF THE DEVICE, naming Alistair K. Chan, Roderick A. Hyde, JordinT. Kare and Lowell L. Wood, Jr. as inventors, filed contemporaneouslyherewith, which is currently co-pending, or is an application of which acurrently co-pending application is entitled to the benefit of thefiling date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,019 filed May 26, 2009, entitled SYSTEM FORALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR ANELECTROCHEMICAL ENERGY GENERATION DEVICE USING HIGH THERMAL CONDUCTIVITYMATERIALS BASED ON STATES OF THE DEVICE, naming Alistair K. Chan,Roderick A. Hyde, Jordin T. Kare and Lowell L. Wood, Jr. as inventors,filed contemporaneously herewith, which is currently co-pending, or isan application of which a currently co-pending application is entitledto the benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,023 filed May 26, 2009, entitled SYSTEM FOROPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICALENERGY GENERATION DEVICE USING MICROCHANNELS BASED ON MOBILE DEVICESTATES AND VEHICLE STATES, naming Alistair K. Chan, Roderick A. Hyde,Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filedcontemporaneously herewith, which is currently co-pending, or is anapplication of which a currently co-pending application is entitled tothe benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,037 filed May 26, 2009, entitled SYSTEM ANDMETHOD OF OPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR ANELECTROCHEMICAL ENERGY GENERATION DEVICE USING THERMAL CONDUCTIVITYMATERIALS BASED ON MOBILE DEVICE STATES AND VEHICLE STATES, namingAlistair K. Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L. Wood,Jr. as inventors, filed contemporaneously herewith, which is currentlyco-pending, or is an application of which a currently co-pendingapplication is entitled to the benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,016 filed May 26, 2009, entitled SYSTEM ANDMETHOD OF OPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR ANELECTROCHEMICAL ENERGY GENERATION DEVICE, DURING CHARGE OR DISCHARGEUSING MICROCHANNELS AND HIGH THERMAL CONDUCTIVITY MATERIALS, namingAlistair K. Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L. Wood,Jr. as inventors, filed contemporaneously herewith, which is currentlyco-pending, or is an application of which a currently co-pendingapplication is entitled to the benefit of the filing date.

For purposes of the USPTO extra-statutory requirements, the presentapplication constitutes a continuation-in-part of U.S. patentapplication Ser. No. 12/455,025 filed May 26, 2009, entitled SYSTEM ANDMETHOD OF OPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR ANELECTROCHEMICAL ENERGY GENERATION DEVICE USING MICROCHANNELS AND HIGHTHERMAL CONDUCTIVITY MATERIALS, naming Alistair K. Chan, Roderick A.Hyde, Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filedcontemporaneously herewith, which is currently co-pending, or is anapplication of which a currently co-pending application is entitled tothe benefit of the filing date.

The United States Patent Office (USPTO) has published a notice to theeffect that the USPTO's computer programs require that patent applicantsreference both a serial number and indicate whether an application is acontinuation or continuation-in-part. Stephen G. Kunin, Benefit ofPrior-Filed Application, USPTO Official Gazette Mar. 18, 2003, availableat http://www.uspto.gov/web/offices/com/sol/og/2003/week11/patbene.htm.The present Applicant Entity (hereinafter “Applicant”) has providedabove a specific reference to the application(s) from which priority isbeing claimed as recited by statute. Applicant understands that thestatute is unambiguous in its specific reference language and does notrequire either a serial number or any characterization, such as“continuation” or “continuation-in-part,” for claiming priority to U.S.patent applications. Notwithstanding the foregoing, Applicantunderstands that the USPTO's computer programs have certain data entryrequirements, and hence Applicant is designating the present applicationas a continuation-in-part of its parent applications as set forth above,but expressly points out that such designations are not to be construedin any way as any type of commentary and/or admission as to whether ornot the present application contains any new matter in addition to thematter of its parent application(s).

All subject matter of the Related Applications and of any and allparent, grandparent, great-grandparent, etc. applications of the RelatedApplications is incorporated herein by reference to the extent suchsubject matter is not inconsistent herewith.

BACKGROUND

The description herein generally relates to the field of microchannelthermal control systems for electrical energy storage devices orelectrochemical energy generation devices. Microchannel cooling has beenconventionally applied to devices such as integrated circuit devices andlaser diodes. However, microchannel cooling has seen limited applicationin cooling of electrical energy storage devices or electrochemicalenergy generation devices.

Conventionally, there is a need for advantageous structures and methodsfor thermal control of electrical energy storage devices orelectrochemical energy generation devices by the use of microchannelsand the like in a variety of structures and in a variety of usage.

SUMMARY

In one aspect, a method of altering an electrical energy storage deviceor an electrochemical energy generation device includes placing anelectrical load to draw current from the electrical energy storagedevice or the electrochemical energy generation device. The electricalenergy storage device or the electrochemical energy generation deviceincludes a housing having an external surface and an internal surface.The method also includes generating electricity by at least onecomponent within the housing. At least one component is configured togenerate electrical energy in combination with other components,chemicals, or materials residing within the housing. Further, the methodincludes thermal control of the electrical energy storage device bytransferring heat to a plurality of microchannels coupled to at leastone of the internal surface of the housing or at least one components.Further still, the method includes rejecting the collected heat througha thermal sink coupled to the microchannels. The thermal sink isconfigured to transfer heat energy from the microchannels and to receivea fluid flowing through the microchannels.

In another aspect, a method of providing power from an electrical energystorage device or an electrochemical energy generation device includesproviding the electrical energy storage device or the electrochemicalenergy generation device including a housing and including internalcomponents within the housing. The method also includes providing amicrochannel fluid thermal control system integrated into at least oneof the interior of the housing or the internal components. Further, themethod includes configuring the electrical energy storage device or theelectrochemical energy generation device for a platform for at leastpartially discharging the electrical energy storage device or theelectrochemical energy generation device and using electrical energyfrom the electrical energy storage device or the electrochemical energygeneration device.

In yet another aspect a method of providing power from an electricalenergy storage device or an electrochemical energy generation deviceincludes receiving the electrical energy storage device or theelectrochemical energy generation device including a housing andincluding internal components within the housing. The method alsoincludes receiving a microchannel fluid thermal control systemintegrated into at least one of the interior of the housing or theinternal components. Further, the method includes discharging power atleast partially from the electrical energy storage device or theelectrochemical energy generation device. The electrical energy storagedevice or the electrochemical energy generation device is configured fora platform for discharging the power source and using the electricalenergy from the electrical energy storage device or the electrochemicalenergy generation device. Further still, the method includes dischargingheat from the fluid flowing through the microchannel fluid thermalcontrol system.

In yet still another aspect, a method of charging an electrical energystorage device includes configuring the electrical energy storage deviceto receive electrical current to charge the electrical energy storagedevice, the electrical energy storage device including a housing havingan external surface and an internal surface. The method also includesconfiguring at least one component within the housing. At least onecomponent is configured to generate electrical energy, during adischarge phase, in combination with other components, chemicals, ormaterials residing within the housing and at least one componentconfigured to receive electrical charge during a charge phase. Further,the method includes providing a plurality of microchannels coupled to atleast one of the internal surface of the housing or the at least oneinternal components to receive heat generated during the charge phaseand providing a fluid within the microchannels. Further still, themethod includes providing a thermal sink, to collect the heat from thefluid, coupled to the microchannels, the thermal sink being configuredto transfer heat energy to or from the fluid flowing through themicrochannels and the thermal sink.

In yet still another aspect, a method of charging an electrical energystorage device, includes placing the electrical energy storage device todraw current from a charging source. The electrical energy storagedevice includes a housing having an external surface and an internalsurface. The method also includes receiving electricity by at least onecomponent within the housing. At least one component is configured toreceive electrical energy in combination with other components,chemicals, or materials residing within the housing. Further, the methodincludes thermal control of the electrical energy storage device bytransferring heat to a plurality of microchannels coupled to at leastone of the internal surface of the housing or the at least one internalcomponents. Further still, the method includes transferring collectedheat through a thermal sink coupled to the microchannels. The thermalsink is configured to transfer heat energy to or from the microchanneland receive a fluid flowing through the microchannels and the thermalsink.

In still yet further another aspect, a method of charging an electricalenergy storage device, includes receiving the electrical energy storagedevice including a housing and including internal components within thehousing. The method also includes integrating a microchannel fluidthermal control system into at least one of the interior of the housingor the internal components. Further, the method includes receivingcurrent by the electrical energy storage device, from a charging source.

In addition to the foregoing, other method aspects are described in theclaims, drawings, and text forming a part of the present disclosure.

In one or more various aspects, related systems include but are notlimited to circuitry and/or programming for effecting theherein-referenced method aspects; the circuitry and/or programming canbe virtually any combination of hardware, software, and/or firmwareconfigured to effect the herein-referenced method aspects depending uponthe design choices of the system designer. Also various structuralelements may be employed depending on design choices of the systemdesigner.

In addition to the foregoing, other system aspects are described in theclaims, drawings, and text forming a part of the present disclosure.

In addition to the foregoing, various other method and/or system and/orprogram product aspects are set forth and described in the teachingssuch as text (e.g., claims and/or detailed description) and/or drawingsof the present disclosure.

The foregoing is a summary and thus contains, by necessity,simplifications, generalizations and omissions of detail; consequently,those skilled in the art will appreciate that the summary isillustrative only and is NOT intended to be in any way limiting. Otheraspects, features, and advantages of the devices and/or processes and/orother subject matter described herein will become apparent in theteachings set forth herein.

BRIEF DESCRIPTION OF THE FIGURES

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description, of which:

FIG. 1 is an exemplary microchannel temperature alteration systemassociated with an electrical energy storage device or anelectrochemical energy generation device;

FIG. 2 is an exemplary depiction of a cross section and cutaway of aplurality of microchannels;

FIG. 3 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice;

FIG. 4 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice;

FIG. 5 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice while discharging;

FIG. 6 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice during discharging;

FIG. 7 is an exemplary process diagram for altering temperature of anelectrical energy storage device during charging;

FIG. 8 is an exemplary process diagram for altering temperature of anelectrical energy storage device during charging;

FIG. 9 is an exemplary process diagram for altering temperature of anelectrical energy storage device during charging;

FIG. 10 is an exemplary high thermal conductivity material alteringtemperature of device associated with an electrical energy storagedevice or an electrochemical energy generation device;

FIG. 11 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice using high thermal conductivity materials;

FIG. 12 is an exemplary process diagram for altering temperature of anelectrical energy storage device or an electrochemical energy generationdevice using high thermal conductivity materials during discharge;

FIG. 13 is an exemplary process diagram of an electrical energy storagedevice or an electrochemical energy generation device using high thermalconductivity materials during discharging;

FIG. 14 is an exemplary process diagram for altering temperature of anelectrical energy storage device for an electrochemical energygeneration device during discharging;

FIG. 15 is an exemplary process diagram for an electrical energy storagedevice using high thermal conductivity materials during charging; and

FIG. 16 is an exemplary process diagram for altering temperature of anelectrical energy storage device using high thermal conductivitymaterials during charging.

FIG. 17 is an exemplary block diagram of a microchannel manifold system.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof. In the drawings,similar symbols typically identify similar components, unless contextdictates otherwise. The illustrative embodiments described in thedetailed description, drawings, and claims are not meant to be limiting.Other embodiments may be utilized, and other changes may be made,without departing from the spirit or scope of the subject matterpresented here. Those having skill in the art will recognize that thestate of the art has progressed to the point where there is littledistinction left between hardware and software implementations ofaspects of systems; the use of hardware or software is generally (butnot always, in that in certain contexts the choice between hardware andsoftware can become significant) a design choice representing cost vs.efficiency tradeoffs. Those having skill in the art will appreciate thatthere are various vehicles by which processes and/or systems and/orother technologies described herein can be effected (e.g., hardware,software, and/or firmware), and that the preferred vehicle will varywith the context in which the processes and/or systems and/or othertechnologies are deployed. For example, if an implementer determinesthat speed and accuracy are paramount, the implementer may opt for amainly hardware and/or firmware vehicle; alternatively, if flexibilityis paramount, the implementer may opt for a mainly softwareimplementation; or, yet again alternatively, the implementer may opt forsome combination of hardware, software, and/or firmware. Hence, thereare several possible vehicles by which the processes and/or devicesand/or other technologies described herein may be effected, none ofwhich is inherently superior to the other in that any vehicle to beutilized is a choice dependent upon the context in which the vehiclewill be deployed and the specific concerns (e.g., speed, flexibility, orpredictability) of the implementer, any of which may vary. Those skilledin the art will recognize that optical aspects of implementations willtypically employ optically-oriented hardware, software, and or firmware.

Microchannels used to cool integrated circuits have been understoodsince the early 1980s and disclosed in research published by professorsDr. David Tuckerman and Dr. Fabian Pease. Pease published researchshowing that microchannels etched into silicon may provide densities ashigh as 1000 W per square centimeter. Such microchannel structures havebeen shown to be put into practical use by cooling integrated circuits,such as those described in U.S. Pat. Nos. 4,541,040; 7,156,159;7,185,697; and U.S. Patent Application Publication No. 2006/0231233 allof which are herein incorporated by reference. However, practicalapplication to thermal control of electrical energy storage devices andelectrochemical energy generation devices has not been accomplished orsuggested. Such microchannel structures may particularly be suited forremoving heat from such devices especially in the case of ultrahighpower density batteries or other electrical storage devices, for examplehyper capacitors, or electrochemical energy generation devices such as,but not limited to fuel cells. Microchannel coolers and passive highthermal conductivity materials, such as, but not limited to diamondfilms, micro heat pipes, microchannel plates, etc., may be used to aidin thermal control of ultra-high performance nano structured batteries,and the like, which will generate high thermal loads and high thermalpower densities, particularly during rapid charging, and/or during rapiddischarging. Such devices may be exemplified by the electrical energystorage device as described in U.S. Published Patent Application No.2008/0044725, which is herein incorporated by reference. The referencealso describes some of the demands which may be fulfilled by such highpower density electrical energy storage devices.

Efficiency of microstructure microchannel heat collectors and thermalsinks, maybe attributed to the heat generated by the energy storage orelectrochemical energy generation devices travelling a relatively smalldistance from the heat generation point in the electrical energy storagedevice, or electrochemical energy generation device, where the heat isgenerated and transferred through the walls of the microchannel. Also,the heat from the walls of the microchannel conducts a very smalldistance into the fluid before the heat energy is carried away to athermal sink, such as a radiator, or the like. Because of the structureof the microchannels where the height of the microchannel is typicallymuch greater than the width, it may be incorporated into variousportions internally of the electrical energy storage device or theelectrochemical energy generation device. For example, the microchannelthermal control structures may be incorporated into the anode, or thecathode of a battery or electrochemical energy generation device.Further, the microchannel structures may be integrated into walls of thehousing of an electrical energy storage device or an electrochemicalenergy generation device. Further, the microchannel structures may beincorporated into other portions internally of the electrical energystorage device or electrochemical energy generation device.

One of the advantages of using the microchannel structures is thatturbulent flow within the channels is not necessary to increase heattransfer efficiency. Microchannel structures neither require nor createturbulent flow. Conventional macrochannels require turbulence toincrease cooling efficiency otherwise the fluid flowing in the middle ofthe channel stays relatively cool. Turbulent flow within the fluidchannel mixes the hot fluid next to the wall of the channel with thecooler fluid in the middle of the channel. However, such turbulence andmixing decreases the efficiency of cooling. Microchannels, instead, havethe advantage that the heat transfer coefficient “h” is inverselyproportional to the width of the channel. As “h” decreases efficiencyincreases. A very narrow channel completely heats a very thin layer offluid as it travels through the collector.

A compact thermal control system for electrical energy storage devicesand electrochemical energy generation devices which may be used inapplications such as, but not limited to mobile devices, electricvehicles, hybrid electric vehicles, etc. maybe based on micro heatexchangers having microchannel heat collectors or heat collectors atleast partially formed of high thermal conductivity materials. Suchmicrochannel heat collectors may be machined or fabricated in silicon orother metals, or other materials including high thermal conductivitymaterials and use active pumps systems or passive systems including, butnot limited to electro osmotic pumps or other pumps, etc. A system suchas this may be a hermetically closed system that may be arranged in amodular fashion in which a portion of microchannels or a portion of ahigh thermal conductivity material heat collector is disposed within thehousing of the electrical energy storage device or the electrochemicalenergy generation device. Other configurations may be such that themicrochannels or other heat collector are incorporated or machineddirectly into portions of the electrical energy storage device orelectrochemical energy generation device. Such microchannel heatexchangers, and such systems as described, may be formed as extremelycompact and power efficient systems such that the total system offersincreased performance characteristics heat pipes, vapor chambers, andother heat transfer devices which are conventionally used for removingheat from similar types of electrical energy storage devices andelectrochemical energy generation devices.

Referring now to FIG. 1, a thermal control system 100 for an electricalenergy storage device or an electrochemical energy generation device 110is depicted. Electrical energy storage device or electrochemical energygeneration device 110 may include, but is not limited to any of avariety of batteries or electrochemical cells such as, but not limitedto lithium based batteries, lithium ion batteries, lithium ion nanophosphate batteries, lithium sulfur batteries, lithium ion polymerbatteries, sodium sulfur batteries, etc. In fact, such thermal controltechnology could be applied to any typical type of electrochemical cellin existence today or to be developed. Further, other types ofelectrical energy storage devices may be used in place of battery 110such as, capacitor devices including, but not limited to capacitivestorage devices, inductive storage devices, electrolytic capacitors,hyper capacitors (as described in U.S. Published Patent Application No.2004/0071944 and U.S. Pat. No. 7,428,137 both of which are hereinincorporated by reference), polyvinylidene fluoride (PVDF) basedcapacitors carbon nanotube based capacitors, other conductive polymerbased capacitors, carbon aerogel based capacitors, etc. Further still,energy storage or electrochemical energy generation device 110 may berepresentative of a fuel cell (as described in U.S. Published PatentApplication No. 2009/0068521 which is herein incorporated by reference),or other electrochemical energy generation devices which may be known,or developed.

Electrical energy storage device or electrochemical energy generationdevice 110 includes a housing 112 having a housing wall with an interiorwall surface 114 and exterior wall surface 112. Interior wall surface114 of housing 112 may be filled with an electrolyte 124 or othermaterial depending on the structure of either the electrical energystorage device or the electrochemical energy generation device 110.Electrical energy storage device or electrochemical energy generationdevice 110 may include, a cathode 120 coupled to a positive terminal 127by a conductor 126. In an exemplary embodiment, load 120 may include anumber of microchannel structures 132. Microchannel structures 132 maybe integrated into cathode 120 or alternatively may be overlaid orcoupled to cathode 120 such that heat emanating from cathode 120 may becollected by the microchannel structures 132. Such microchannelstructures 132 may be formed by any of a variety of methods includingetching, micromachining, and the like. Various materials for formingcathode 120 may be used, as is well known in the art depending on thetype of electrical energy storage device or electrochemical energygeneration device 110. A fluid connection 136 is coupled tomicrochannels 132. Fluid connections 136 are coupled to a thermal sink138 through a pump 140. Such a thermal sink 138 may be a radiator orother form of heatsink. A pump 140 may also be coupled to a fluidcircuit 136 in order to move fluid through microchannels 132. In oneembodiment, a pump is used. In alternative embodiments, the fluid may bemoved by osmotic pressure or the like without use of a pump 140. Similarto cathode 120, an anode 122 is electrically coupled to a negativeterminal 129 of electrical energy storage device or electrochemicalenergy generation device 110 by a conductor 128. Similar to cathode 120,anode 122 may also include a microchannel structure 130 integrated into,overlaid, or coupled to anode 122. Microchannel structure 130 is fluidlycoupled, by a fluid connection 134, to thermal sink 138 in much the sameway that fluid connection 136 is coupled to thermal sink 138.

In an exemplary embodiment, a load or a charge source 120 iselectrically coupled to positive terminal 127 and negative terminal 129of electrical energy storage device or electrochemical energy generationdevice 110. Load 120 may be any of a variety of possible devices usingenergy from electrical energy storage device or electrochemical energygeneration device 110. Charge source 120 may be any type of chargingdevice that is used to charge electrical energy storage device 110.During charging, or during discharging by use of a load, large amountsof heat may be generated within electrical energy storage device orelectrochemical energy generation device 110. Accordingly, it may beadvantageous to use a microchannel thermal control system as described.In one exemplary embodiment, a controller 160 may be coupled to pump140. Controller 160 may be any of a variety of controllers controldevices, etc. for controlling the speed of pump 140. For example, pump140 may be coupled to a sensor 162 which detects characteristics ofelectrical energy storage device or electrochemical energy generationdevice 110. Sensor 162 may be located at any of a variety of locationsassociated with electrical energy storage device or electrochemicalenergy generation device 110. Alternatively, controller 160 may becoupled to load or charge source 120 to detect characteristics of theusage of load or charge source 120. Controller 160 may be used tocontrol pump 140 based on a variety of factors including, but notlimited to a current draw, a current discharge, voltage, various statesof the device using energy from electrical energy storage device orelectrochemical energy generation device 110, or variable various statesof a vehicle using electrical energy storage device or electrochemicalenergy generation device 110, or further states of the charge source120.

In accordance with an exemplary embodiment, it may be desirable to coolthe electrical energy storage device or the electrochemical energygeneration device in anticipation of a heat generating event, such asdischarge or energy demand or charging. By cooling in advance of theheat generating event, the thermal control system may be better enabledto keep up with the cooling demands. It is in a sense a “head start” forthe cooling system. In an exemplary embodiment the “head start” may bedetermined by a processor which may be enabled with programming tomonitor systems and make determinations as to when energy may bedemanded or charging may occur. In other exemplary embodiments, the“head start” may be done in accordance with a schedule or in accordancewith other preset or predetermined times.

Referring now to FIG. 2, a perspective cross-section of an exemplarycathode 120 is depicted. The cross section of FIG. 2 depictsmicrochannels 132 built into or integrated into cathode 120.Microchannels 132 are sealed fluid conduits having a top portion 133shown partially cut-away. Microchannels 132 are not shown in a scaleddepiction because microchannels 132 conventionally are of extremelysmall width, on the order of, but not limited to the width of a humanhair. The height of microchannels 132 may be much greater than the widthto achieve efficient laminar flow thermal control. The high aspect ratioof the microchannels increases the total surface area of themicrochannel structures touching the fluid flow. The width of themicrochannels 132 may be on the order of 10 μm, but is not limitedthereto. FIG. 2 depicts a single configuration of microchannels 132 inwhich the microchannels are arranged side-by-side and fluid may flowthrough all the microchannels in parallel or may flow in a serial mannerback and forth (serpentine) through each of the microchannels tocomplete a fluid circuit. Many other configurations of microchannels mayalso be conceived without departing from the scope of the disclosure andof the invention as claimed herein.

Referring now to FIG. 17, an alternative configuration of a microchannelthermal control system 1700 includes more than one of substrates 1710which support microchannels 1720. Substrates 1710 may be integrated intoor otherwise coupled to any of the electrical energy storage device orelectrochemical energy generation device components as discussed.Microchannels 1720 may be of a parallel or any other configuration inwhich fluid may flow from an inlet manifold 1730 to an outlet manifold1740. Such flow may proceed through any of the more than one sets ofmicrochannels through microchannel inlets 1750 and through microchanneloutlets 1760. In yet another configuration each of the sets ofmicrochannels may include one or more interconnections 1770 and 1780between the sets of microchannels. Providing such a structure has manyadvantages including, but not limited to performance characteristics,manufacturing characteristics, and application characteristics, asdesired.

In one exemplary embodiment, electrical energy storage device orelectrochemical energy generation device 110 is an electrical energystorage device that has a housing 112. The housing may have an externaland internal surface, the internal surface being depicted as surface114. Many components reside within the housing including, in someinstances, the anode 122 and the cathode 120. Further, other chemicalsor materials may also reside within the housing including an electrolyte124, or other materials or chemicals as needed to generate electricityor to store energy. In one exemplary embodiment a plurality ofmicrochannels is coupled to at least one of the internal surface 114 ofthe housing or at least one of the internal components such as, but notlimited to cathode 120 and anode 122. A thermal sink 138 is coupled tothe microchannels fluid connection 136. The thermal sink 138 isconfigured to transfer heat to or from fluid flowing throughmicrochannels 132. In one exemplary embodiment, microchannels may beformed in a portion of a wall of the housing 114. Also, microchannelsmay be formed in a portion of any of the components residing withinhousing 112. In another exemplary embodiment, microchannels may beformed in a portion of a catalyst which may be disposed within housing112. Further still, microchannels may be formed in electrical contacts,a current carrying conductor, a dialectic, etc. Also, microchannels maybe formed integrally to any of these components or housings, or may beoverlaid or disposed on or coupled to any of these components orhousings. It may be advantageous to couple the microchannels to areas orcomponents where the most heat is generated or collects.

In an exemplary embodiment, the fluid flowing through microchannels 132may include any of a variety of fluids. Such fluids may include air,gas, water, antifreeze, molten salt, molten metal, micro-particles,liquid droplets, solid particles, etc. (see e.g. US 2006/0231233). Also,in an exemplary embodiment, the fluid may be at least partiallycirculated by any of a variety of devices including, a pump, amechanical pump, electromagnetic (MHD) pump, electroosmotic pump, etc.The fluid may be circulated in any of a variety of ways including, byconvection, by electroosmosis, etc. Further, in accordance with anexemplary embodiment, the electrical energy storage device may includeone or more electrochemical cells, capacitive storage devices, inductivestorage devices, electrolytic capacitors, supercapacitors,hypercapacitors, polyvinylidpue fluoride (PVDF) based capacitors, andvarious batteries, including, but not limited to lithium basedbatteries, lithium batteries, lithium ion batteries, lithium ionnanophosphate batteries, lithium sulfur batteries, lithium ion polymerbatteries, etc.

In accordance with another exemplary embodiment, electrical energystorage device or electrochemical energy generation device 110 is a fuelcell. The fuel cell may include a housing having an external surface andan internal surface 114. At least one component resides within thehousing. At least one component is configured to generate electricalpower in combination with at least one other components, chemicals, ormaterials residing within the housing. In one embodiment, suchcomponents may include, but are not limited to cathode 120 and anode122. A plurality of microchannels 132 may be coupled to the least one ofthe internal surface of the housing or the at least one internalcomponents. A thermal sink 138, is coupled to the microchannels. Thermalsink 138 is configured to transfer heat to or from fluid flowing throughthe microchannels. In one exemplary embodiment, the microchannels areformed in a portion of a wall of the housing or at least one componentresiding within the housing. Similar to the electrical energy storagedevice configuration, many of the same components may reside within thehousing and may include microchannels. Further, any other componentswhich may be unique to a fuel cell, compared to the electrical energystorage device depicted in FIG. 1, may also include microchannels tocool such components.

Referring now to FIG. 3, a process 300 is depicted for controllingtemperature of an electrical energy storage device or electrochemicalenergy generation device. Process 300 includes providing an electricalenergy storage device or an electrochemical energy generation devicewith a housing (process 310). Process 300 also includes coupling anelectrical energy storage device or electrochemical energy generationdevice components within the housing (process 320). Microchannels areformed in a surface of the electrical energy storage device or theelectrochemical energy generation device components (process 330). Afluid is then flowed through the microchannels to provide thermalcontrol to the components and to the overall electrical energy storagedevice or electrochemical energy generation device (process 340).

Referring now to FIG. 4, a process 400 of using electrical energystorage device or an electrochemical energy generation device isdepicted. Process 400 includes coupling a load to draw current from theelectrical energy storage device or the electrochemical energygeneration device (process 410). The electrical energy storage device orthe electrochemical energy generation device has a housing with anexternal surface and an internal surface. Process 400 also includesgenerating electricity by the electrical energy storage device or theelectrochemical energy generation device using at least one componentwithin the housing. The least one component is configured to generateelectrical energy in combination with other components, chemicals, ormaterials residing within the housing (process 420). The electricalenergy storage device is then cooled by transferring heat to fluidflowing through the microchannels coupled to at least one of theinternal surface of the housing or at least one of the components(process 430). Heat is then rejected from the thermal sink that iscoupled to the microchannels. The thermal sink is configured to transferheat energy from the microchannels and is configured to receive a fluidflowing through the microchannels (process 440).

In accordance with another exemplary embodiment, a process of providingpower for an electrical energy storage device or an electrochemicalenergy generation device includes providing an electrical energy storagedevice or an electrochemical energy generation device having a housingand including internal components within the housing. The process alsoincludes providing a microchannel fluid thermal control systemintegrated into at least one of the interior of the housing or theinternal components. Further, the process includes configuring theelectrical energy storage device or electrochemical energy generationdevice for a platform for at least partially discharging the electricalenergy storage device or the electrochemical energy generation deviceand using electrical energy from the electrical energy storage device.

In accordance with yet another exemplary embodiment, a process ofproviding power from an electrical energy storage device or anelectrochemical energy generation device includes receiving theelectrical energy storage device or the electrochemical energygeneration device housing and including internal components within thehousing. The process also includes receiving a microchannel fluidthermal control system integrated into at least one of the interior ofthe housing or the internal components. Further, the process includesdischarging power at least partially from the electrical energy storagedevice or the electrochemical energy generation device. The electricalenergy storage device or the electrochemical energy generation device isconfigured for a platform for discharging the electrical energy storagedevice or the electrochemical energy generation device and using theelectrical energy from the electrical energy storage device.

Another exemplary process includes charging an electrical energy storagedevice. The electrical energy storage device is configured to receiveelectrical current to charge the electrical energy storage device. Theelectrical energy storage device includes a housing having an externalsurface and an internal surface. The process for charging the electricalenergy storage device also may include configuring at least onecomponent within the housing. The least one component being configuredto generate electrical energy during a discharge phase in combinationwith other complements, chemicals, or materials residing within thehousing. At least one component is configured to receive electricalcharge during a charge phase. The exemplary process also includesproviding a plurality of microchannels coupled to a least one out of theinternal surface of the housing or the least one internal components toreceive a heat generated during the charge phase and providing a fluidwithin the microchannels. A thermal sink is also provided to collectheat from the fluid coupled to the microchannels. The thermal sink isconfigured to transfer heat energy to or from the fluid flowing throughthe microchannels and the thermal sink.

A method of charging a electrical energy storage device also includesplacing the electrical energy storage device to draw current from acharging source. The electrical energy storage device includes a housinghaving an external surface and an internal surface. The process includesreceiving electricity by at least one component within the housing. Atleast one component is configured to receive electrical energy incombination with other components chemicals, or materials residingwithin the housing. The process also includes thermal control of theelectrical energy storage device by transferring heat to a plurality ofmicrochannels coupled to a least one of the internal surface of thehousing or the at least one internal components. Further, the processincludes transferring collected heat through the thermal sink coupled tothe microchannels. The thermal sink is configured to transfer heatenergy to or from the microchannels and receive a fluid through themicrochannels in the thermal sink.

Further still, a method of charging an electrical energy storage deviceis disclosed. The method includes receiving the electrical energystorage device including a housing and including internal componentswithin the housing. The process also includes integrating a microchannelfluid thermal control system into at least one of the interior housingor the internal components. Further, the method includes receivingcurrent by the electrical energy storage device, from a charging source.

Referring now to FIG. 5, a process 500 for thermal control of anelectrical energy storage device during discharge is depicted. Process500 includes providing an electrical energy storage device (process510). Process 500 also includes integrating a microchannel fluid thermalcontrol system into the interior of the electrical energy storage device(process 520). Process 500 further includes configuring the electricalenergy storage device for discharging electricity (process 530).

Referring now to FIG. 6, a process for discharging power from a powerfrom an electrical energy storage device or an electrochemical energygeneration device is depicted process 600 includes receiving anelectrical energy storage device or an electrochemical energy generationdevice (process 610). Process 600 also includes receiving a microchannelfluid thermal control system that is integrated into the interior of theelectrical energy storage device or the electrochemical energygeneration device (process 620). Further, process 600 includesdischarging power from the electrical energy storage device or theelectrochemical energy generation device to a load using the stored orgenerated electrical energy (process 630). Using the microchannelthermal control system heat is then discharged from the electricalenergy storage device or electrochemical energy generation device(process 640).

Referring now to FIG. 7, a process 700 for thermal control of anelectrical energy storage device while charging is depicted. Process 700includes configuring an electrical energy storage device to receiveelectrical charge current (process 710). The charge current is used tocharge the electrical energy storage device, the electrical energystorage device capable of receiving a high power density current therebycausing heating of the electrical energy storage device and componentsof the electrical energy storage device. Process 700 also includesconfiguring interior components of the electrical energy storage deviceto generate electricity (process 720). Further, process 700 includesproviding a plurality of microchannels into the interior of a housing ofthe electrical energy storage device (process 730). The interior of thehousing may include interior surfaces of the housing as well ascomponents within the housing. Further still, process 700 includesproviding a radiative structure or a thermal sink that is used tocollect heat from the fluids flowing through the microchannels (process740).

Referring now to FIG. 8, a process 800 is depicted for thermal controlof an electrical energy storage device during charging. Process 800includes placing the electrical energy storage device in a situation todraw current from a charging source (process 810). Process 800 alsoincludes receiving electricity by at least one component of theelectrical energy storage device (process 820). Because heat isgenerated within the electrical energy storage device during thecharging process, process 800 also includes thermal control of theelectrical energy storage device by transferring heat to microchannelswhich are configured within housing of the electrical energy storagedevice (process 830). Heat is then rejected via a radiator or otherthermal sink structure from the microchannels by transferring heat fromthe microchannel to the fluid flowing through the microchannels and tothe thermal sink (process 840).

Referring now to FIG. 9, a process 900 is depicted for thermal controlof an electrical energy storage device during charging. Process 900includes receiving an electrical energy storage device in a situationwhereby the electrical energy storage device may be charged (process910). Process 900 also includes receiving a microchannel fluid thermalcontrol system is integrated into the electrical energy storage device(process 920). Such a microchannel fluid thermal control system that maybe one that is applied directly to components within the housing of theelectrical energy storage device or may be one that is integrated intothe housing of the electrical energy storage device or components withinthe housing of the electrical energy storage device. Process 900 alsoincludes receiving current by the electrical energy storage device fromthe charging source (process 930).

Referring now to FIG. 10, a system 1000 for thermal control of anelectrical energy storage device or an electrochemical energy generationdevice is depicted. Electrical energy storage device or electrochemicalenergy generation device 1000 may include a housing 1010 having an outersurface 1012 and an inner surface 1014. Within housing 1010 may be aplurality of components, chemicals, materials, etc. For example, acathode 1020 may be coupled to a positive terminal 1027 by a conductiveconnection 1026. Cathode 1020 may have a surface 1022. Surface 1022 maybe overlaid with or be integrated into cathode 1020 a high thermalconductivity material 1023 that is in thermal communication with thefluid circuit 1036. High thermal conductivity material 1023 may have ahigh k-value. The high k-value may be greater than approximately 410W/(m*K). Fluid circuit 1036 may be used to circulate fluid to conductheat away from cathode 1020 via the high thermal conductivity of thematerial 1023. In electrical energy storage devices and electrochemicalenergy generation devices that are charged or discharged rapidly or thatmanage a high power density, efficient thermal control is needed tomaintain desired temperature. The use of high thermal conductivitymaterials as applied, allows efficient rejection of heat to maintaindesired temperatures. Thermal circuit 1036 is coupled to a thermal sink1038 and optionally through a pump, 1040. Pump 1040 helps move fluidthrough circuit 1036. Similarly, an anode 1030 may reside within housing1010 having a high thermal conductivity material 1033 coupled to orintegrated into surface 1032. A fluid circuit 1034 is in thermalcommunication with material 1033. Fluid circuit 1034 is coupled tothermal sink 1038 optionally through a pump 1040. Anode 1030 iselectrically coupled to a negative terminal 1029 through conductiveconnection 1028. Positive terminal 1027 and negative terminal 1029 maybe coupled to a load or charge source 1070. In an exemplary embodiment acontroller 1060 may be coupled to any of a variety of mechanisms withinsystem 1000 including, but not limited to, pump 1040 for controlling therate of fluid flow within circuits 1036 and 1038, for example.Controller 1060 may be coupled to any of a variety of sensors including,but not limited to a current sensor 1062 which may be in a variety oflocations including, but not limited to at terminal 1027. Many othertypes of sensors may also be used including, but not limited totemperature sensors, voltage sensors, flow sensors, chemicalconcentration sensors, and the like. The use of high thermalconductivity materials to aid the rejection of heat within the interiorof an electrical energy storage device or an electrochemical energygeneration device may be beneficial to provide adequate thermal controlof such devices during rapid charging or rapid discharging, etc.

In various exemplary embodiments, the electrical energy storage deviceor the electrochemical energy generation device includes high thermalconductivity materials which include but are not limited to diamond anddiamond based materials, diamond films, diamond composites (such asdiamond-loaded copper or diamond-loaded aluminum), carbon fibers(including graphite fiber composites, as may exist in combination withmaterials in a matrix such as aluminum, Silicon Carbide (SiC), orvarious polymers), carbon-carbon materials (such as carbon fibers in acarbon matrix), carbon nanotubes, carbon aerogels and the like. Further,the high thermal conductivity materials may be formed into micro heatpipes, and other structures which will be beneficial to increase thermalconductivity. Such materials are exemplified in the followingreferences: (1) information found athttp://www.nsf.gov/awardsearch/showAward.do?AwardNumber=0750177 as ofApr. 30, 2009, (2) “Applications for ultrahigh thermal conductivitygraphite fibers,” T. F. Fleming, W. C. Riley, Proc. SPIE, Vol. 1997, 136(1993) DOI:10.1117/12.163796, Online Publication Date: 14 Jan. 2005;“Vapor grown carbon fiber reinforced aluminum composites with very highthermal conductivity,” Jyh-Ming Ting, Max L. Lake J. Mater. Res. V. 10#2 pp. 247-250 DOI: 10.1557/JMR. 1995.0247 and (3) “New low-CTEultrahigh-thermal-conductivity materials for lidar laser diodepackaging,” C. Zweben Proc. SPIE, Vol. 5887, 58870D (2005) DOI:10.1117/12.620175.

Referring now to FIG. 11, a method 1100 of thermal control of anelectrical energy storage device or an electrochemical energy generationdevice is depicted. The method includes providing a housing which mayhave an external surface and an internal surface (process 1110). Themethod also includes coupling at least one component within the housing.At least one component is configured to generate electrical power incombination with other components, chemicals, or materials which may beresiding within the housing (process 1120). Further, the method includesforming a plurality of thermal control structures of a high thermalconductivity material which is coupled to at least one of the internalsurface of the housing or the least one internal components. The highthermal conductive material may have a high k-value, the high k-valuebeing greater than approximately 410 W/(m*K) (process 1130). Furtherstill, the method includes flowing a fluid adjacent the high thermalconductivity material to remove heat from the high thermal conductivitymaterial (process 1140).

In another exemplary embodiment, the thermal sink may be formed at leastpartially of a high thermal conductivity material as described above.Such a structure may be used in a method of thermal control of anelectrical energy storage device or an electrochemical energy generationdevice. Such a method may include providing a housing having an externalsurface and an internal surface. The method may also include coupling atleast one component within the housing, at least one component beingconfigured to generate electrical power in combination with othercomponents, chemicals, or materials residing within the housing.Further, the method of thermal control may include forming a pluralityof thermal control structures coupled to at least one of the internalsurface of the housing or the at least one internal components. Themethod further includes flowing a fluid adjacent a plurality of thermalcontrol structures and transferring heat to or from a thermal sink. Thethermal sink is formed at least partially of a high thermal conductivematerial having a high k-value. The high k-value may be greater thanapproximately 410 W/(m*K).

Referring now to FIG. 12, a process of thermal control of an electricalenergy storage device or an electrochemical energy generation device1200 is depicted. Process 1200 may include placing an electrical load todraw current from the electrical energy storage device or theelectrochemical energy generation device (process 1210). Process 1200may also include thermal control of the electrical energy storage deviceor electrochemical energy generation device by transferring heat tothermal control structures which are formed of a high k-value material(process 1220). Further, process 1200 includes flowing fluid adjacentthe high k-value material to remove heat therefrom (process 1230).

Referring now to FIG. 13, a method 1300 for providing power from anelectrical energy storage device or an electrochemical energy generationdevice includes providing the electrical energy storage device or theelectrochemical energy generation device. The electrical energy storagedevice or the electrochemical energy generation device includes ahousing and includes internal components within the housing (process1310). Process 1300 also includes thermal control of the electricalenergy storage device or the electrochemical energy generation device bytransferring heat to thermal control structures which are formed of highk-value material (process 1320). Further, process 1300 includes flowingfluid adjacent the high k-value material (process 1330). Further still,process 1300 includes configuring the electrical energy storage deviceor the electrochemical energy generation device for a platform fordischarging the electrical energy storage device or the electrochemicalenergy generation device (process 1340).

Referring now to FIG. 14, a method 1400 of providing power from anelectrical energy storage device or an electrochemical energy generationdevice includes providing the electrical energy storage device or theelectrochemical energy generation device with a housing and withinternal components within the housing (process 1410). The method alsoincludes thermal control of the electrical energy storage device or theelectrochemical energy generation device by transferring heat to aplurality of thermal control of structures formed of high k-valuematerial (process 1420). Further, the method includes flowing fluidadjacent the high k-value materials (process 1430). Further still,process 1400 includes configuring the electrical energy storage deviceor the electrochemical energy generation device for a platform fordischarging the electrical energy storage device or the electrochemicalenergy generation device and using the electrical energy from theelectrical energy storage device or the electrochemical energygeneration device (process 1400).

Referring now to FIG. 15, a method 1500 of charging an electrical energystorage device may include configuring the electrical energy storagedevice to receive electrical current to charge the electrical energystorage device (process 1510). The electrical energy storage device mayinclude a housing having an external surface and an internal surface.The method may also include configuring at least one component withinthe housing. The least one component is configured to generateelectrical energy, during a discharge phase, in combination with othercomponents chemicals or materials residing within housing and at leastone component configured to receive electrical charge during a chargephase (process 1520). A plurality of thermal control structures areprovided of a high thermal conductivity material coupled to at least oneof the internal surface of the housing or the least one internalcomponents (process 1520). The high thermal conductivity material mayhave a high k-value the high k-value is greater than approximately 410W/(m*K). The thermal conductivity material is configured to receive heatgenerated during the charge phase (process 1530). A thermal sink isprovided to transfer heat to or from the fluid coupled to the highthermal conductivity material (process 1540). A thermal sink isconfigured to transfer heat energy to or from the fluid flowing throughthe high thermal conductivity material and the thermal sink.

Referring now to FIG. 16, a method 1600 of charging an electrical energystorage device includes placing the electrical energy storage device ina situation to draw charge current (process 1600). Process 1600 alsoincludes thermal control of the electrical energy storage device bytransferring heat to a plurality of thermal control structures formed ofhigh thermal conductivity material and flowing fluid thereby (process1620). Process 1600 also includes rejecting heat from the fluid througha radiative structure or a thermal sink (process 1630).

In another exemplary embodiment, structures, systems, and processesdescribed above may also be applied to structures, systems, andprocesses which use microchannel thermal control for thermal control ofelectrical energy storage devices or electrochemical energy generationdevices and base such thermal control on current (or other states of theelectrical energy storage device or electrochemical energy generationdevice, such as (but not limited to voltage, power, temperature, chargestate, etc.) that is either delivered to or from the electrical energystorage device or the electrochemical energy generation device. Thecurrent may be sensed by a variety of sensors and controlled by a pumpthat controls the rate of fluid flow using any of a variety of controlalgorithms and controllers. Such control algorithms may include but arenot limited to classical control, feedback control, nonlinear control,adaptive control, etc. The control algorithms may also include stateestimator's, adaptive control algorithms, Kalman filters, models of theelectrical energy storage device or the electrochemical energygeneration device. The pump may be controlled is any of a variety ofways including increased flow as current draw increase, flow may beincreased linearly as current draw increase, flow may be decreased ascurrent draw decreased, flow may be decreased nonlinearly as currentdraw decreases, flow may be increased linearly as current drawincreases, flow may be decreased nonlinearly as current draw decreases,or flow may be increased nonlinearly as current draw increases and flowmay be decreased linearly as current draw decreases. Further, otherpossibilities are equally applicable depending on the designspecifications and desired responses.

In another exemplary embodiment, structures, systems, and processesdescribed above may also be applied to structures, systems, andprocesses which use high thermal conductivity materials and for thermalcontrol of electrical energy storage devices or electrochemical energygeneration devices and base such thermal control on a state or states ofa mobile device which the electrical energy storage device orelectrochemical energy generation device is powering. The current may besensed by a variety of sensors or by software which determines the stateof the mobile device and a pump is controlled that controls the rate offluid flow using any of a variety of control algorithms and controllers.Such control algorithms may include but are not limited to classicalcontrol, feedback control, nonlinear control, adaptive control, etc. Thecontrol algorithms may also include state estimator's, adaptive controlalgorithms, Kalman filters, models of the electrical energy storagedevice or the electrochemical energy generation device, etc.

The mobile device states on which fluid flow may be based may includeany of a variety of states including but not limited to brightness,processing speed, processing demands, processor tasks, displaybrightness, hard disk state, hard disk speed, hard disk usage, wirelesscommunication state, etc. Such a mobile device may include any of avariety of mobile electronic devices including, but not limited to, acomputer, a laptop computer, a mobile phone, a global positioning system(GPS) unit, a power tool, etc. Further, other possibilities are equallyapplicable depending on the performance characteristics desired.

For example, in accordance with an exemplary embodiment, the mobiledevice may be a laptop computer having a battery pack that is cooled bya microchannel thermal control system. The microchannel thermal controlsystem may include a pump or other device that controls the rate offluid flow through the microchannels and thus the rate of thermalcontrol. Because current demands may cause heating of the battery packdue to increased processing speed, increased processing tasks, increasedhard disk speed, increased hard disk usage, etc. As discussed above, thedemands for thermal control therefore increase. The control system isconfigured to detect or determine the state of the mobile device andmake adjustments to the rate of thermal control by altering the rate offlow through the microchannel system thermal control based on mobiledevice states may be applied in the context of microchannel-basedthermal control, high thermal conductivity material-based thermalcontrol systems, and further microchannel and high thermal conductivitymaterial thermal control systems.

The use of such a system in which control of fluid flow is based onmobile device states may be applied to a thermal control system whichuses microchannels. Similarly, the system may be applied to anelectrochemical energy generation device or electrical energy storagedevice that uses thermal and high thermal conduct to the materials inconjunction with a fluid thermal control system. Further, the controlsystem described in which thermal control is based on mobile devicestates may also be applied to a system which uses a combination ofmicrochannel thermal control and high thermal conductivity to thematerials.

In another particular exemplary embodiment, the fluid thermal controlsystem described above may be applied to electrical energy storagedevices and energy to generation devices that are used in vehiclesystems. In such a system a fluid pump may be coupled to a microchannelthermal control system of the electrical energy storage device or theelectrochemical energy generation device. The electrical energy storagedevice or the electrochemical energy generation device may be configuredto provide electrical energy to the drivetrain of the vehicle or inpowering other equipment in the vehicle. A processor is configured todetermine at least one of the states of the vehicle. A vehicle sensormay be coupled to the processor and may be configured to sense at leastone vehicle characteristic. A controller is used with a controlalgorithm and maybe configured to control the functioning of the pump asa function of at least one vehicle state.

In accordance with an exemplary embodiment, the vehicle states mayinclude but are not limited to engine speed, engine torque, engineacceleration, engine temperature, terrain grade, vehicle acceleration,vehicle speed, etc. Also, the concept and control system may be appliedto any of a variety of vehicles including, but not limited to, acomputer integrated into a vehicle, a truck, a boat, a bus, train, anautomobile, etc. In other exemplary embodiments, a variety of sensorsmay be used including but not limited to current sensors, voltagesensors, temperature sensors, speed sensors, accelerometers, orientationsensors, attitude sensors, etc. The methods of applying thermal controlbased on vehicle states may be applied in the context ofmicrochannel-based thermal control, high thermal conductivitymaterial-based thermal control systems, and further microchannel andhigh thermal conductivity material thermal control systems.

In another exemplary embodiment, an electrical energy storage device orelectrochemical energy generation device includes a housing having anexternal surface and an internal surface. Components may reside withinthe housing. The components are configured to generate electrical energyin combination with at least one of other components, chemicals, ormaterials residing within the housing. A plurality of microchannels maybe fashioned to at least one of the internal surface of the housing orthe at least one internal components. The plurality of microchannels maybe divided into at least two sets of microchannels although any numberof sets may be used. The two sets, for example, may be separated by atleast one valve. A controller is configured to provide control signalsto the valve. The valve may be configured to control fluid flow in atleast two sets of microchannel such that fluid could flow through eitherset of microchannels or both sets simultaneously. The control signalsare based on thermal control demand. For example, the thermal controldemand may be of the overall system, or the thermal control demand maybe localized. A thermal sink is coupled to the microchannels. Thethermal sink is configured to transfer heat energy to or from themicrochannel surfaces via the fluid flowing through the microchannel andthe sinks. In such an embodiment, the thermal control demands may be metby controlling the action of opening or closing of the valves such thatfluid may selectively flow through various sets of microchannel toprovide needed localized thermal control.

The foregoing detailed description has set forth various embodiments ofthe devices and/or processes via the use of block diagrams, flowcharts,and/or examples. Insofar as such block diagrams, flowcharts, and/orexamples contain one or more functions and/or operations, it will beunderstood by those within the art that each function and/or operationwithin such block diagrams, flowcharts, or examples can be implemented,individually and/or collectively, by a wide range of hardware, software,firmware, or virtually any combination thereof. In one embodiment,several portions of the subject matter described herein may beimplemented via Application Specific Integrated Circuits (ASICs), FieldProgrammable Gate Arrays (FPGAs), digital signal processors (DSPs), orother integrated formats. However, those skilled in the art willrecognize that some aspects of the embodiments disclosed herein, inwhole or in part, can be equivalently implemented in integratedcircuits, as one or more computer programs running on one or morecomputers (e.g., as one or more programs running on one or more computersystems), as one or more programs running on one or more processors(e.g., as one or more programs running on one or more microprocessors),as firmware, or as virtually any combination thereof, and that designingthe circuitry and/or writing the code for the software and or firmwarewould be well within the skill of one of skill in the art in light ofthis disclosure. In addition, those skilled in the art will appreciatethat the mechanisms of the subject matter described herein are capableof being distributed as a program product in a variety of forms, andthat an illustrative embodiment of the subject matter described hereinapplies regardless of the particular type of signal bearing medium usedto actually carry out the distribution. Examples of a signal bearingmedium include, but are not limited to, the following: a recordable typemedium such as a floppy disk, a hard disk drive, a Compact Disc (CD), aDigital Video Disk (DVD), a digital tape, a computer memory, etc.; and atransmission type medium such as a digital and/or an analogcommunication medium (e.g., a fiber optic cable, a waveguide, a wiredcommunications link, a wireless communication link, etc.). Further,those skilled in the art will recognize that the mechanical structuresdisclosed are exemplary structures and many other forms and materialsmay be employed in constructing such structures.

In a general sense, those skilled in the art will recognize that thevarious embodiments described herein can be implemented, individuallyand/or collectively, by various types of electromechanical systemshaving a wide range of electrical components such as hardware, software,firmware, or virtually any combination thereof; and a wide range ofcomponents that may impart mechanical force or motion such as rigidbodies, spring or torsional bodies, hydraulics, and electro-magneticallyactuated devices, or virtually any combination thereof. Consequently, asused herein “electromechanical system” includes, but is not limited to,electrical circuitry operably coupled with a transducer (e.g., anactuator, a motor, a piezoelectric crystal, etc.), electrical circuitryhaving at least one discrete electrical circuit, electrical circuitryhaving at least one integrated circuit, electrical circuitry having atleast one application specific integrated circuit, electrical circuitryforming a general purpose computing device configured by a computerprogram (e.g., a general purpose computer configured by a computerprogram which at least partially carries out processes and/or devicesdescribed herein, or a microprocessor configured by a computer programwhich at least partially carries out processes and/or devices describedherein), electrical circuitry forming a memory device (e.g., forms ofrandom access memory), electrical circuitry forming a communicationsdevice (e.g., a modem, communications switch, or optical-electricalequipment), and any non-electrical analog thereto, such as optical orother analogs. Those skilled in the art will also appreciate thatexamples of electromechanical systems include but are not limited to avariety of consumer electronics systems, as well as other systems suchas motorized transport systems, factory automation systems, securitysystems, and communication/computing systems. Those skilled in the artwill recognize that electromechanical as used herein is not necessarilylimited to a system that has both electrical and mechanical actuationexcept as context may dictate otherwise.

In a general sense, those skilled in the art will recognize that thevarious aspects described herein which can be implemented, individuallyand/or collectively, by a wide range of hardware, software, firmware, orany combination thereof can be viewed as being composed of various typesof “electrical circuitry.” Consequently, as used herein “electricalcircuitry” includes, but is not limited to, electrical circuitry havingat least one discrete electrical circuit, electrical circuitry having atleast one integrated circuit, electrical circuitry having at least oneapplication specific integrated circuit, electrical circuitry forming ageneral purpose computing device configured by a computer program (e.g.,a general purpose computer configured by a computer program which atleast partially carries out processes and/or devices described herein,or a microprocessor configured by a computer program which at leastpartially carries out processes and/or devices described herein),electrical circuitry forming a memory device (e.g., forms of randomaccess memory), and/or electrical circuitry forming a communicationsdevice (e.g., a modem, communications switch, or optical-electricalequipment). Those having skill in the art will recognize that thesubject matter described herein may be implemented in an analog ordigital fashion or some combination thereof.

Those skilled in the art will recognize that it is common within the artto implement devices and/or processes and/or systems in the fashion(s)set forth herein, and thereafter use engineering and/or businesspractices to integrate such implemented devices and/or processes and/orsystems into more comprehensive devices and/or processes and/or systems.That is, at least a portion of the devices and/or processes and/orsystems described herein can be integrated into other devices and/orprocesses and/or systems via a reasonable amount of experimentation.Those having skill in the art will recognize that examples of such otherdevices and/or processes and/or systems might include—as appropriate tocontext and application—all or part of devices and/or processes and/orsystems of (a) an air conveyance (e.g., an airplane, rocket, hovercraft,helicopter, etc.), (b) a ground conveyance (e.g., a car, truck,locomotive, tank, armored personnel carrier, etc.), (c) a building(e.g., a home, warehouse, office, etc.), (d) an appliance (e.g., arefrigerator, a washing machine, a dryer, etc.), (e) a communicationssystem (e.g., a networked system, a telephone system, a Voice over IPsystem, etc.), (f) a business entity (e.g., an Internet Service Provider(ISP) entity such as Comcast Cable, Quest, Southwestern Bell, etc), or(g) a wired/wireless services entity such as Sprint, Cingular, Nextel,etc.), etc.

One skilled in the art will recognize that the herein describedcomponents (e.g., steps), devices, and objects and the discussionaccompanying them are used as examples for the sake of conceptualclarity and that various configuration modifications are within theskill of those in the art. Consequently, as used herein, the specificexemplars set forth and the accompanying discussion are intended to berepresentative of their more general classes. In general, use of anyspecific exemplar herein is also intended to be representative of itsclass, and the non-inclusion of such specific components (e.g., steps),devices, and objects herein should not be taken as indicating thatlimitation is desired.

With respect to the use of substantially any plural and/or singularterms herein, those having skill in the art can translate from theplural to the singular and/or from the singular to the plural as isappropriate to the context and/or application. The varioussingular/plural permutations are not expressly set forth herein for sakeof clarity.

The herein described subject matter sometimes illustrates differentcomponents contained within, or connected with, different othercomponents. It is to be understood that such depicted architectures aremerely exemplary, and that in fact many other architectures can beimplemented which achieve the same functionality. In a conceptual sense,any arrangement of components to achieve the same functionality iseffectively “associated” such that the desired functionality isachieved. Hence, any two components herein combined to achieve aparticular functionality can be seen as “associated with” each othersuch that the desired functionality is achieved, irrespective ofarchitectures or intermedial components. Likewise, any two components soassociated can also be viewed as being “operably connected”, or“operably coupled”, to each other to achieve the desired functionality,and any two components capable of being so associated can also be viewedas being “operably couplable”, to each other to achieve the desiredfunctionality. Specific examples of operably couplable include but arenot limited to physically mateable and/or physically interactingcomponents and/or wirelessly interactable and/or wirelessly interactingcomponents and/or logically interacting and/or logically interactablecomponents.

While particular aspects of the present subject matter described hereinhave been shown and described, it will be apparent to those skilled inthe art that, based upon the teachings herein, changes and modificationsmay be made without departing from the subject matter described hereinand its broader aspects and, therefore, the appended claims are toencompass within their scope all such changes and modifications as arewithin the true spirit and scope of the subject matter described herein.Furthermore, it is to be understood that the invention is defined by theappended claims. It will be understood by those within the art that, ingeneral, terms used herein, and especially in the appended claims (e.g.,bodies of the appended claims) are generally intended as “open” terms(e.g., the term “including” should be interpreted as “including but notlimited to,” the term “having” should be interpreted as “having atleast,” the term “includes” should be interpreted as “includes but isnot limited to,” etc.). It will be further understood by those withinthe art that if a specific number of an introduced claim recitation isintended, such an intent will be explicitly recited in the claim, and inthe absence of such recitation no such intent is present. For example,as an aid to understanding, the following appended claims may containusage of the introductory phrases “at least one” and “one or more” tointroduce claim recitations. However, the use of such phrases should notbe construed to imply that the introduction of a claim recitation by theindefinite articles “a” or “an” limits any particular claim containingsuch introduced claim recitation to inventions containing only one suchrecitation, even when the same claim includes the introductory phrases“one or more” or “at least one” and indefinite articles such as “a” or“an” (e.g., “a” and/or “an” should typically be interpreted to mean “atleast one” or “one or more”); the same holds true for the use ofdefinite articles used to introduce claim recitations. In addition, evenif a specific number of an introduced claim recitation is explicitlyrecited, those skilled in the art will recognize that such recitationshould typically be interpreted to mean at least the recited number(e.g., the bare recitation of “two recitations,” without othermodifiers, typically means at least two recitations, or two or morerecitations). Furthermore, in those instances where a conventionanalogous to “at least one of A, B, and C, etc.” is used, in generalsuch a construction is intended in the sense one having skill in the artwould understand the convention (e.g., “a system having at least one ofA, B, and C” would include but not be limited to systems that have Aalone, B alone, C alone, A and B together, A and C together, B and Ctogether, and/or A, B, and C together, etc.). In those instances where aconvention analogous to “at least one of A, B, or C, etc.” is used, ingeneral such a construction is intended in the sense one having skill inthe art would understand the convention (e.g., “a system having at leastone of A, B, or C” would include but not be limited to systems that haveA alone, B alone, C alone, A and B together, A and C together, B and Ctogether, and/or A, B, and C together, etc.). It will be furtherunderstood by those within the art that virtually any disjunctive wordand/or phrase presenting two or more alternative terms, whether in thedescription, claims, or drawings, should be understood to contemplatethe possibilities of including one of the terms, either of the terms, orboth terms. For example, the phrase “A or B” will be understood toinclude the possibilities of “A” or “B” or “A and B.”

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purposes ofillustration and are not intended to be limiting, with the true scopeand spirit being indicated by the following claims.

1. A method of operating an electrical energy storage device or anelectrochemical energy generation device, comprising: placing anelectrical load to draw current from the electrical energy storagedevice or the electrochemical energy generation device, the electricalenergy storage device or the electrochemical energy generation deviceincluding a housing having an external surface and an internal surface;generating electricity by at least one component within the housing, atleast one component being configured to generate electrical energy incombination with other components, chemicals, or materials residingwithin the housing; altering the temperature of the electrical energystorage device by transferring heat to a plurality of microchannelscoupled to at least one of the internal surface of the housing or atleast one components; and rejecting the collected heat through a thermalsink coupled to the microchannels, the thermal sink being configured totransfer heat energy from a fluid and to receive the fluid flowingthrough the microchannels.
 2. The method of claim 1, wherein themicrochannels are formed in a portion of a wall of the housing.
 3. Themethod of claim 1, wherein the microchannels are formed in a portion ofat least one component.
 4. The method of claim 1, wherein themicrochannels are formed in a portion of at least one component and atleast one component includes a cathode.
 5. The method of claim 1,wherein the microchannels are formed in a portion of at least onecomponent and at least one component includes an anode.
 6. The method ofclaim 1, wherein the microchannels are formed in the material includinga portion of at least one component and at least one component includesa catalyst material.
 7. The method of claim 1, wherein the microchannelsare formed in a portion of at least one component and at least onecomponent includes a solid electrolyte material.
 8. The method of claim1, wherein the microchannels are formed in a portion of at least onecomponent and at least one component includes an electrical contact. 9.The method of claim 1, wherein the microchannels are formed in a portionof at least one component and at least one component includes a currentcarrying conductor.
 10. The method of claim 1, wherein the microchannelsare formed in a portion of at least one component and at least onecomponent includes a material and the material including a dielectric.11. The method of claim 1, wherein the microchannels are formed in aportion of at least one component and at least one component includes aseparator.
 12. The method of claim 1, wherein the microchannels areformed at least partially integrally on the internal surface of thehousing.
 13. The method of claim 1, wherein the microchannels are formedat least partially integrally on a surface of at least one component.14. The method of claim 1, wherein the microchannels are configured toinduce laminar flow of the fluid through at least a portion of themicrochannels.
 15. The method of claim 1, wherein at least one componentincludes a thermal control component, and the thermal control componentis disposed within the housing.
 16. The method of claim 1, wherein thefluid includes air.
 17. The method of claim 1, wherein the fluidincludes a gas.
 18. The method of claim 1, wherein the fluid includeswater.
 19. The method of claim 1, wherein the fluid includes antifreeze.20. The method of claim 1, wherein the fluid includes molten salt. 21.The method of claim 1, wherein the fluid includes molten metal.
 22. Themethod of claim 1, wherein the fluid includes micro-particles.
 23. Themethod of claim 1, wherein the fluid includes a phase change material.24. The method of claim 1, wherein the fluid includes liquid droplets.25. The method of claim 1, wherein the fluid includes solid particles.26. The method of claim 1, wherein the fluid is at least partiallycirculated by a pump.
 27. The method of claim 1, wherein the fluid is atleast partially circulated by a mechanical pump.
 28. The method of claim1, wherein the fluid is at least partially circulated by electromagneticforces.
 29. The method of claim 1, wherein the fluid is at leastpartially circulated by an electromagnetic (MHD) pump.
 30. The method ofclaim 1, wherein the fluid is at least partially circulated by anelectro osmotic pump.
 31. The method of claim 1, wherein the fluid is atleast partially circulated by convection.
 32. The method of claim 1,wherein the fluid is at least partially circulated by electroosmosis.33. The method of claim 1, wherein the fluid is at least partiallycirculated by capillary forces.
 34. The method of claim 1, wherein theelectrical energy storage device includes one or more vanadium redoxcells.
 35. The method of claim 1, wherein the electrical energy storagedevice includes one or more capacitive storage device.
 36. The method ofclaim 1, wherein the electrical energy storage device includes one ormore inductive storage devices.
 37. The method of claim 1, wherein theelectrical energy storage device includes one or more electrolyticcapacitors.
 38. The method of claim 1, wherein the electrical energystorage device or the electrochemical energy generation device includesa sodium sulfur battery.
 39. The method of claim 1, wherein at least onecomponent includes an electrode, and the electrode includesmicrochannels alternating with current flow pathways.
 40. The method ofclaim 1, wherein the microchannels are formed by etching.
 41. A methodof providing power from an electrical energy storage device or anelectrochemical energy generation device, comprising: providing theelectrical energy storage device or the electrochemical energygeneration device including a housing and including internal componentswithin the housing; providing a microchannel fluid thermal controlsystem integrated into at least one of the interior of the housing orthe internal components; and configuring the electrical energy storagedevice or the electrochemical energy generation device for a platformfor at least partially discharging the electrical energy storage deviceor the electrochemical energy generation device and using electricalenergy from the electrical energy storage device or the electrochemicalenergy generation device.
 42. A method of providing power from anelectrical energy storage device or an electrochemical energy generationdevice, comprising: receiving the electrical energy storage device orthe electrochemical energy generation device including a housing andincluding internal components within the housing; receiving amicrochannel fluid thermal control system integrated into at least oneof the interior of the housing or the internal components; dischargingpower at least partially from the electrical energy storage device orthe electrochemical energy generation device, the electrical energystorage device or the electrochemical energy generation deviceconfigured for a platform for discharging the power source and using theelectrical energy from the electrical energy storage device or theelectrochemical energy generation device; and discharging heat from thefluid flowing through the microchannel fluid thermal control system. 43.A method of charging an electrical energy storage device, comprising:configuring the electrical energy storage device to receive electricalcurrent to charge the electrical energy storage device, the electricalenergy storage device including a housing having an external surface andan internal surface; configuring at least one component within thehousing, at least one component being configured to generate electricalenergy, during a discharge phase, in combination with other components,chemicals, or materials residing within the housing and at least onecomponent configured to receive electrical charge during a charge phase;providing a plurality of microchannels coupled to at least one of theinternal surface of the housing or the at least one internal componentsto receive heat generated during the charge phase and providing a fluidwithin the microchannels; and providing a thermal sink, to collect theheat from the fluid, coupled to the microchannels, the thermal sinkbeing configured to transfer heat energy to or from the fluid flowingthrough the microchannels and the thermal sink.
 44. A method of chargingan electrical energy storage device, comprising: placing the electricalenergy storage device to draw current from a charging source, theelectrical energy storage device including a housing having an externalsurface and an internal surface; receiving electricity by at least onecomponent within the housing, at least one component being configured toreceive electrical energy in combination with other components,chemicals, or materials residing within the housing; altering thetemperature of the electrical energy storage device by transferring heatto a plurality of microchannels coupled to at least one of the internalsurface of the housing or the at least one internal components; andtransferring collected heat through a thermal sink coupled to themicrochannels, the thermal sink being configured to transfer heat energyto or from the microchannel and receive a fluid flowing through themicrochannels and the thermal sink.